NG3S919 - Advanced Manufacturing Systems 01 Jul 2022 - 31 Aug 2028 | Version 1

Associated Module Information

Module Code: NG3S919
Module Title: Advanced Manufacturing Systems
Faculty: Faculty of Computing, Engineering and Science
Faculty Group: Information and Electronics
Faculty Sub Group: Electronics
Module Leader: Alexandre Oleon, Hammad Nazir
Module Team:
First Intended Intake: SEP 2022 Final Year of Intake: 2027
Date Closed:
Credit Value: 20 Credit Level: 6
Language: English
Percentage of Module Taught in Welsh: 0
Equivalent Module:
HECOS codes: 100163 - electrical and electronic engineering
HECOS Code Weighting: 100

Document Version Information

Version 1
Valid From 01 Jul 2022
Valid To 31 Aug 2028

Module Aims

This module will provide the student with detailed understanding of the design, commercial and manufacturing factors required to successfully develop a prototype into a fully manufactured and tested product.

Content Summary

The following will be explored:

The challenge of new product introduction (NPI):

• The design for manufacture & test. The use of simulation & digital tools within NPI and production development. To gain an appreciation for different types of manufacturing systems engineering-automation & simulation.
• Concurrent engineering approach & Life cylce engineering.

Product Specification and Feasibility:
• Standards. Economics and costing. Safety. Electromagnetic Compatibility (EMC) Product image, reliability and serviceability.
• Links Between Design and Manufacture. From idea to mass production of electronic products, including schematic, layout and testing.
• Design for Testability (DFT), Design for Manufacture (DFM), Computer Aided Design (CAD) tools for production. Failure Modes and Effects Analysis (FMEA).
• The dangers of Electro Static Discharge (ESD) and prevention method used within design and manufacture. Environmental & Quality Assurance
• Process identification and modelling. The influence of quality on design, procurement, installation, rework and maintenance. Quality & Environmental Management Techniques / Systems. ISO 9001:2000, ISO14001.

Smart Manufacturing:
• Introduction to Industry 4.0 and Robotics, Basic principles and technologies of a Smart Factory, Digitization and the Manufacturing Enterprise, Criteria for Smart Factories, Leveraging Sensors on the Factory Floor, Customer Order Management, Managing Component Inventory, Materials Management, Sensors at the Dock Door, Inter-facility Shipment Tracking, Sensor-enabled Supplier Networks, Sensors in Aftermarket Services, Adding Sensors to Existing Machinery, Connected Factories in the Cloud.

Manufacturing Systems:
• Statistical Process Control (SPC) Key Performance Indicators (KPI), Just in Time (JIT), Kanban System, Manufacturing Resource Planning, Enterprise resource planning (ERP)

Manufacturing Technologies:
• Printed Circuit Board (PCB) technology and manufacturing techniques. PCB Design Rules, device mounting and packaging. Component handling, sequencing and insertion. ESD management.

• Data analysis-Design of Experiments, product testing, future analysis, problem solving.

• Solder processes, Device types, packaging, Thermal stress. Package placement Testing Strategies
• Selecting a test strategy in relation to product type, volume and mix - JTAG technology. Component, In-circuit, Functional, Environmental and System Testing. Test software generation techniques and costs.
• Methods - Automatic Test Equipment, Flying probe, in-circuit and functional and Xray testing.
Compliance
• Compliance testing and accreditation (CE, E, e mark).
• EMC test procedures, directives, standards, test plans.

Learning and Teaching Methods

Activity Type Hours
Lecture 48
Practical classes and workshops 12
External visits 8
Independent Study 74
Directed Study 38
Formative Assessment - Independent 20
Total Hours Selected 200

Learning Outcomes

# Learning Outcome
LO1 Knowledge and understanding of the equipment, materials and processes and test strategies employed within an electronic manufacturing environment, including testing.
LO2 Will be able to analyse the principles of managing engineering processes, related to new product introduction and concurrent engineering.

Module Requisites

N/A

Assessment Criteria

Assessment Category Assessment Type Description Duration Word Count Weight (%) Best of? Pass Mark
Synchronous Onsite Practical Assessment Practical Coursework (Onsite) 2 Exercises undertaken in class or in laboratory aimed at assessing the application of knowledge, analytical, problem-solving or evaluative skills 0 2000 50 No 40
Synchronous Onsite Practical Assessment Practical Coursework (Onsite) 1 Exercises undertaken in class or in laboratory aimed at assessing the application of knowledge, analytical, problem-solving or evaluative skills 0 2000 50 No 40

Assessment Matrix

Assessment Type Learning Outcomes
LO1 LO2
Practical Coursework (Onsite) 2
Practical Coursework (Onsite) 1

Reading List

McMahan C (2010), Root Cause Analysis Made Easy: A Guide for Investigating Errors and Improving Processes, Cheryl McMahan, ISBN:978-14659-1400-2

Peter Wilson(2012), The Circuit Designer's Companion,?Newnes, ISBN 978-0-08-097138